4/17 Webinar "Latest Trends in Semiconductor Packaging and Semiconductor Encapsulation Materials"
The encapsulating materials for advanced semiconductor packages require various characteristics such as low stress, moisture resistance, and high reliability. Design and evaluation guidelines based on epoxy resin.
■Title: "Latest Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulation Materials" ――As chipletization and 3D packaging advance in semiconductors, there is a growing demand for more sophisticated material design in encapsulation materials. This seminar will provide a detailed practical perspective on the latest trends in semiconductor packaging, including raw material selection, design techniques, and reliability evaluation of encapsulation materials. ■Date and Time: April 17, 2026 (Friday) 13:30–16:30 ■Target Audience: Designers of semiconductor encapsulation materials, engineers using semiconductor encapsulation materials, designers of epoxy resins and hardeners for semiconductor encapsulation materials ■Knowledge Gained from the Seminar: - Trends in semiconductor packaging - Knowledge about raw materials for semiconductor encapsulation materials - Design techniques for semiconductor encapsulation materials and evaluation techniques for semiconductor encapsulation materials
- Company：シーエムシー・リサーチ
- Price：Other
